SMT production line need pick and place machine, conveyor, stencil printer, reflow oven, loader, unloader, etc. Today we talk about reflow oven function ,classification,Speed factors, Applicable to which products, and show we how to choose.
Reflow oven is a heating device that heats up to the melting point of the solder paste by heating, and then cools and solidifies to achieve the soldering effect. Common reflow soldering sizes are: 5 temperature zones, 6 temperature zones, 8 temperature zones, 10 temperature zones, 12 temperatures Area.
The optimal speed of reflow soldering is 1.8m/min, but generally it is 1.2-1.5M/min. Generally, the speed of reflow soldering is mainly determined by the material and thickness of the PCB. The speed of PCB thickness can be adjusted faster, and the speed of thickness needs to be adjusted slower. If the speed is adjusted too fast, the welding effect will be affected. Note: There are few temperature zones and fast board passing speed can easily cause false welding, false welding and even tin explosion.
For finished products, it is widely applicable to LED lights and small household appliances industries; For component types, conventional driving components are applicable.
Due to the different sizes of reflow soldering, the production capacity is different, and the mismatch of the model selected by the customer will affect the speed and product quality of the entire line. Appropriate reflow soldering is mainly based on the customer’s product type, PCB size, precision component type, capacity requirements, and production expectations for later development to choose the machine.