Features 

1. Machine highlights

(1) high speed multi modular head, apply to ultra small chip 0201-10*10mm large chip, wider component range

(2) improve recognition performance, size up to 40*40mm.

(3) each module 20 spindles, both high speed and intelligent with light compact design.

(4) each placement head with independent detection function, improves the stability of the equipment and the reliability of the product.

(5)adopt high end magnetic linear motor, servo system and multi function modular head, the capacity increased by 25% compared with traditional machine, optimum placement speed reach 120000 CPH.

2. flexible production

(1)fixed line scan camera: components with size less than 10*10 mm, or height less than 6mm can be used to high speed and high precision identification

(2)MARK recognition: high precision mark recognition system, adopt 3-color illumination recognition, apply to any shape mark and lens, wider range of applications.

(3)docking cart, smart double head tape feeder

 3. high reliability

(1)brand new self-developed high precision placement head

(2)combine high accuracy, mark recognition camera with fixed flight vision camera, ensure placement accuracy

(3)the placement head adopt independent vacuum detection improve placement performance

(4)off-line programming, save time of changeover cycle

(5)software AI intelligent learning function and automatic optimization function

4. transmission system structure

(1)two gantry, 120 spindles * 2 gantry, total 40 spindles

(2)flexible PCB handling capabilities, double rail, both gantry can mount the same large PCB at the same time, realizing flexible production

(3)flexible wiring through modular placement heads and various production modes.